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Book of Abstracts, 1st International Workshop on Plasma Cryogenic Etching Processes (PlaCEP)

Abstract : The workshop PlaCEP is a gathering of enthusiastic scientists and engineers in the field of cryogenic etching of semiconductor-based materials using e.g. SF6, HBr or Cl2-plasma chemistry at temperatures below -10°C. It includes the modelling, simulation and/or experimental (atomic layer) etching of conventional materials like silicon, germanium, gallium arsenide, indium phosphide and emerging materials (2D materials like graphene or MoS2), but also its oxide and nitride ceramic compounds. Furthermore, research activities on e.g. porous low-k materials (such as organosilicate glasses) – where cryogenic adsorption and subsequent etching is beneficial or the study of reactive gases (and physisorbed self-assembled monolayers SAMs) that only adsorb on the to-be-etched materials at low temperatures – are encouraged to join. Finally, studies on low-damage and high-selective plasma process, the formation of cryogenic dust plasmas or black silicon surfaces that benefit from cryogenic conditions are highly welcomed. A large part of the workshop will be dedicated to discussions about last requirements on nanofabrication issues that cryogenic processes could address.
Keywords : Plasma etching
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https://hal.archives-ouvertes.fr/hal-03669219
Contributeur : Sylvain Iséni Connectez-vous pour contacter le contributeur
Soumis le : lundi 16 mai 2022 - 14:44:56
Dernière modification le : mercredi 26 octobre 2022 - 08:10:27

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2022_PlaCEP_book.pdf
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Booklet of abstracts, 1st PlaCEP 2022

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  • HAL Id : hal-03669219, version 1

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Sylvain Iséni, Rémi Dussart. Book of Abstracts, 1st International Workshop on Plasma Cryogenic Etching Processes (PlaCEP). Rémi Dussart; Sylvain Iseni. 1st International Workshop on Plasma Cryogenic Etching Processes (PlaCEP), May 2022, Orléans, France. , 2022. ⟨hal-03669219⟩

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